Electronic device having a composite structure

ABSTRACT

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/606,920, filed May 26, 2017, and entitled “Electronic Device Having aComposite Structure,” which claims the benefit under 35 U.S.C. § 119(e)of U.S. Provisional Patent Application No. 62/397,781, filed on Sep. 21,2016, and entitled “Aluminum-Steel Composite,” the contents of which areincorporated by reference as if fully disclosed.

FIELD

The described embodiments relate generally to an electronic devicehaving two dissimilar materials joined along a bonding region. Moreparticularly, the present embodiments relate to joining dissimilarmetals and/or a metal component and a ceramic component via aninterstitial material to form an electronic device enclosure.

BACKGROUND

Dissimilar materials may be joined together to form an electronic deviceenclosure or other composite structure. The composite structure mayexhibit material properties of one or both of the materials. Fordissimilar metals, such composites may be susceptible to brittlefracture or other failure modes at a joint or bonding region between thedissimilar materials. For example, directly joining (e.g., welding)dissimilar metals having different melting temperatures, electrical orthermal conductivities, and/or tensile strengths may contribute to theproduction of brittle intermetallic compounds.

SUMMARY

Embodiments of the present invention are directed to an electronicdevice enclosure and methods for forming the same.

In a first aspect, the present disclosure includes an enclosure for anelectronic device. The enclosure includes an enclosure component formedfrom an enclosure material. The enclosure component may define anexterior surface of the enclosure and an opening configured to receive adisplay. The enclosure further includes an internal component formedfrom a metal material that may be different than the enclosure materialand affixed to the enclosure component along a bonding region. Thebonding region may include an interstitial material that has a meltingtemperature less than a melting temperature of either one of theenclosure material or the metal material. The bonding region may alsoinclude one or more of the enclosure material or the metal material.

A number of feature refinements and additional features are applicablein the first aspect and contemplated in light of the present disclosure.These feature refinements and additional features may be usedindividually or in any combination. As such, each of the followingfeatures that will be discussed may be, but are not required to be, usedwith any other feature combination of the first aspect.

For example, in an embodiment, the bonding region includes a blendedmelt layer formed from the interstitial material and the one or more ofthe enclosure material or the metal material. The blended melt layer maybe affixed to both of the enclosure component and the internalcomponent. In some cases, the enclosure material may be aluminum and themetal material may be steel. In other cases, the enclosure material maybe a ceramic and the metal material may be steel.

In another embodiment, the interstitial material may include at leastone of nickel, zinc, or aluminum alloy. The enclosure may be configuredto receive a printed circuit board (PCB). In this regard, the internalcomponent may be configured to electrically conduct a signal receivedfrom the PCB. Additionally or alternatively, the internal component mayform an electrical shield along an interior surface of the enclosure.

In this regard, a second aspect of the present disclosure includes amethod of manufacturing a device enclosure. The method includes abuttingan enclosure component and an internal component along a bonding region.The method further includes affixing the enclosure component to theinternal component by heating the bonding region to a temperature thatis less than a melting temperature of one of the enclosure component orthe internal component. The internal component may include ainterstitial material at the bonding region. The interstitial materialand the enclosure component may form a blended melt layer within thebonding region in response to the heating.

A number of feature refinements and additional features are applicablein the second aspect and contemplated in light of the presentdisclosure. These feature refinements and additional features may beused individually or in any combination. As such, each of the followingfeatures that will be discussed may be, but are not required to be, usedwith any other feature combination of the second aspect.

For example, in an embodiment, the internal component may define athreaded feature. In this regard, the method may further includeattaching a printed circuit board (PCB) to the enclosure component byadvancing a fastener through the PCB and into the threaded feature.Additionally or alternatively, the method may further include anodizingat least one of the enclosure component or the internal component priorto affixing the enclosure component and the internal component.

According to another embodiment, the interstitial material may includeone of nickel, zinc, or aluminum alloy. The interstitial material maycoat the internal component prior to affixing the enclosure componentand the internal component. In some cases, the interstitial material maybe a first interstitial material and the enclosure component may includea second interstitial material at the bonding region. The first andsecond interstitial materials and the enclosure component may form theblended melt layer within the bonding region in response to the heating.

In another embodiment, affixing the enclosure component and the internalcomponent may further include compressing the enclosure component andthe internal component. Additionally or alternatively, heating thebonding region may further include applying an ultrasonic vibration toat least one of the enclosure component and the internal component.

In this regard, a third aspect of the present disclosure includes anenclosure for an electronic device. The enclosure includes an enclosurecomponent formed from an enclosure material and having sidewalls thatdefine an internal volume and a top surface that defines an openingconfigured to receive a touch-sensitive display. The enclosure furtherincludes a structural member formed from a steel-based material. Theenclosure further includes a first interstitial material affixed to asurface of the enclosure component. The enclosure further includes asecond interstitial material affixed to a surface of the structuralmember. A portion of the first and second interstitial materials form ablended melt layer joining the enclosure component and the structuralmember within the internal volume of the enclosure. A meltingtemperature of each of the first and second interstitial materials isless than a melting temperature of the steel-based material.

A number of feature refinements and additional features are applicablein the third aspect and contemplated in light of the present disclosure.These feature refinements and additional features may be usedindividually or in any combination. As such, each of the followingfeatures that will be discussed may be, but are not required to be, usedwith any other feature combination of the third aspect.

For example, in an embodiment, the blended melt layer may be formed fromat least a portion of the enclosure component. In some cases, thestructural member may define a threaded feature. The structural membermay be configured to secure a printed circuit board (PCB) to theenclosure component by receiving a threaded fastener that extendsthrough the PCB. The PCB may include a processing unit configured tocontrol a function of the electronic device.

According to another embodiment, the structural member may be a ribextending between the sidewalls of the enclosure. The rib may beconfigured to provide rigidity to an exterior surface of the enclosure.The rib may separate the internal volume into discrete compartments. Oneof the discrete compartments may be configured to receive a printedcircuit board (PCB). The rib may define a passage configured to receivea set of wires extending from the PCB and between the discretecompartments of the internal volume.

In addition to the exemplary aspects and embodiments described above,further aspects and embodiments will become apparent by reference to thedrawings and by study of the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 depicts a sample electronic device including a compositestructure;

FIG. 2 depicts a cross-sectional view of the embodiment of theelectronic device of FIG. 1, taken along line A-A of FIG. 1;

FIG. 3 depicts a cross-sectional view of the embodiment of theelectronic device of FIG. 1, taken along line B-B of FIG. 1;

FIG. 4A depicts an enclosure component having a first interstitialmaterial and an internal component having a second interstitialmaterial;

FIG. 4B depicts a composite structure including the enclosure componentand the internal component of FIG. 4A and having a blended melt layer;

FIG. 4C depicts an enlarged view of the composite structure of FIG. 4B;

FIG. 5A depicts an enclosure component and an internal component havinginterstitial sheets positioned therebetween;

FIG. 5B depicts a composite structure including the enclosure componentand the internal component of FIG. 5A and having a blended melt layer;

FIG. 6A depicts an enclosure component and an internal component havinga interstitial material;

FIG. 6B depicts a composite structure including the enclosure componentand the internal component of FIG. 6A and having a blended melt layer;

FIG. 7 depicts a sample bonding tool rotating an internal component toform a bond between the internal component and an enclosure component;

FIG. 8A depicts another embodiment of a sample electronic deviceincluding a composite structure;

FIG. 8B depicts an exploded view of the sample electronic device of FIG.8A;

FIG. 8C depicts an enlarged view of the composite structure of FIG. 8B;

FIG. 9A depicts another embodiment of a sample electronic deviceincluding a composite structure;

FIG. 9B depicts an exploded view of the sample electronic device of FIG.9A;

FIG. 9C depicts an enlarged view of the composite structure of FIG. 9B;

FIG. 9D depicts an enlarged view of another embodiment of the compositestructure of FIG. 9B;

FIG. 10A depicts another embodiment of a sample electronic deviceincluding a composite structure;

FIG. 10B depicts an exploded view of the sample electronic device ofFIG. 10A;

FIG. 10C depicts an enlarged view of the composite structure of FIG.10A; and

FIG. 11 is a flow diagram of a method for manufacturing a deviceenclosure.

DETAILED DESCRIPTION

The description that follows includes sample systems, methods, andapparatuses that embody various elements of the present disclosure.However, it should be understood that the described disclosure may bepracticed in a variety of forms in addition to those described herein.

The present disclosure describes systems, devices, and techniquesrelated to forming a device enclosure from dissimilar materials. Thedissimilar materials may be affixed to one another to form a compositestructure that may define multiple different features or elements of thedevice enclosure. For example, a first dissimilar material may form anenclosure component (e.g., including sidewalls, top and bottom panels,external cases, cover, or the like) and a second dissimilar material mayform an internal component (e.g., including bosses, ribs, plates,shields, fasteners, or the like). Affixing the enclosure component andthe internal component to form a composite structure may allow thedevice enclosure to exhibit material properties of one or both of theconstituent dissimilar materials.

The enclosure component and the internal component may be non-separablewithin the composite structure. For example, the enclosure component andthe internal component may be permanently affixed or coupled to oneanother such that the enclosure component and the internal component donot delaminate or separate without the composite structure breaking. Inparticular, the enclosure component and the internal component may beaffixed to one another at or through a bonding region of the compositestructure. The bonding region may include, or be defined by, a blendedmelt layer that is affixed to each of the enclosure component and theinternal component. The blended melt region may be formed from aninterstitial material and one or more of the dissimilar materials thatform the enclosure component and the internal component.

A coupling process may affix the enclosure component to the internalcomponent at the bonding region using the interstitial material. Forexample, the interstitial material may be adhered or affixed to one orboth of the enclosure component and the internal component (e.g.,platting, cladding, coatings, or the like, described herein) and have amelting temperature that is less than a melting temperature of eitherone of the enclosure component or the internal component. In thisregard, in one embodiment, the coupling process may involve abutting theenclosure component and the internal component along a bonding regionthat includes the interstitial material, and subsequently heating thebonding region to a bonding temperature. The bonding temperature may becalibrated to melt the interstitial material and the one or more of thedissimilar materials that form the enclosure component and the internalcomponent. This may cause the blended melt layer to form. In thisregard, the blended melt layer may be defined by a heterogeneous layerhaving material elements of the interstitial material chemically oratomically bonded to material elements of the dissimilar materials. Inother embodiments, as described herein, the coupling process may producea blended melt layer substantially defined by the interstitial material(e.g., as may be the case when the coupling process causes theinterstitial material to melt but not the aluminum component).

In an embodiment, the coupling process may affix the enclosure componentand the internal component without melting the internal component at thebonding region. For example, the bonding temperature may be less than amelting temperature of the dissimilar material that forms the internalcomponent. The interstitial material may be plated, cladded, orotherwise affixed to a surface of the internal component prior toforming the blended melt region. Accordingly, the internal component maybe affixed to the blended melt region via the interstitial material. Theinterstitial material may thereby define a transition region at which aportion of the interstitial material is attached to the internalcomponent (via plating, cladding, or the like) and another portion ofthe interstitial material is attached to the enclosure component (viathe blended melt region). Where the dissimilar materials are, forexample, aluminum and steel, this may result in composite structure withsubstantially reduced brittle intermetallic compounds that would impedeor otherwise weaken the cohesiveness of an aluminum and steel bond.

It will be appreciated that the composite structure may include anyappropriate interstitial material having material properties that allowit to affix to one, or both, of the dissimilar materials that form theblended melt region. As described herein, sample interstitial materialsmay include nickel, zinc, or aluminum components or alloy. In otherembodiments, other interstitial materials are contemplated within thespirt of this disclosure.

The interstitial materials may be arranged in any appropriate shape,configuration, or position at the bonding region to facilitate thecoupling process described herein. In one embodiment, the interstitialmaterial may be deposited onto a surface of the enclosure component andthe aluminum component prior to the coupling process. The couplingprocess may cause a portion of the interstitial material that isdeposited on the enclosure component to melt with, and into, a portionof the interstitial material that is deposited on the internalcomponent, thereby defining the blended melt layer of the compositestructure. The respective interstitial materials may thus form direct orchemical bonds between one another, and optionally with one of thedissimilar materials, to form the blended melt layer that affixes theenclosure component and the internal component along the bonding region.

In another embodiment, the interstitial material may be deposited on theinternal component prior to the coupling process and the enclosurecomponent may be substantially free of interstitial material prior tothe coupling process. The coupling process may cause a portion of theinterstitial material to melt with a portion of the enclosure componentto define the blended melt region of the composite structure throughdirect bonds between the enclosure component and the interstitialmaterial.

A variety of techniques may be implemented to form the compositestructure. In one non-limiting example, the enclosure component may beabutted to the internal component along a bonding region such that theinterstitial material is positioned between the enclosure component andthe internal component. The bonding region (or a portion thereof) may beheated to affix the enclosure component and the internal component in amanner that substantially reduces brittle intermetallic compounds,according to the embodiments described herein. For instance, heat may beapplied to the bonding region to melt a portion of the interstitialmaterial (and optionally a portion of one of the enclosure or internalcomponents) without melting the other one of the enclosure or internalcomponents. The bonding region may be heated by any appropriatetechnique, including direct heat (e.g., via a welding torch or similarimplement), electrical heating elements, and/or other techniquesoperative to heat the bonding region, including techniques operative toheat a localized region of the bonding region. In some instances, acompression or ultrasonic vibration may be applied to the bondinginterface to affix the enclosure and internal components.

The enclosure component and the internal components may be formed from avariety of dissimilar materials. In one embodiment, the enclosurecomponent and the internal component may be formed from dissimilarmetals, such as aluminum and steel. For example, the enclosure componentmay be an aluminum sheet that forms an exterior surface of a deviceenclosure and the internal component may be a steel component thatdefines a threaded feature (e.g., such as a threaded feature thatreceives a threaded fastener for securing a printed circuit board (PCB)to the enclosure component). The blended melt region may affix thealuminum component and the steel component. For example, as describedherein, the blended melt region may include an interstitial material anda portion of the aluminum component, such that the blended melt regionis formed by direct bonds between the interstitial material and thealuminum component. This may substantially reduce brittle intermetalliccompounds that may otherwise be present when directly bonding aluminumto steel. Further, the blended melt region may allow the steel componentto be affixed to an anodized or otherwise coated or treated aluminumstructure. In other embodiments, other dissimilar metals arecontemplated.

In other embodiments, one of the dissimilar materials may be a ceramic.For example, the enclosure component may be a ceramic sheet that formsan exterior surface of a device enclosure and the internal component maybe a steel component that defines a threaded feature, as describedabove. The blended melt region may affix the ceramic component and thesteel component. For example, as described herein, the blended meltregion may include an interstitial material and a portion of thealuminum component, such that the blended melt region is formed bydirect bonds between the interstitial material and one or both of theceramic component or the steel component. In a particularimplementation, the interstitial material may extend between the ceramicand metal components and may be a foil or a sheet constructed from tin,aluminum, or other material having a lower melting point than that ofthe metal component (e.g., such as a lower melting temperature than atitanium component). A bonding tool, such as an ultrasonic transducer orother appropriate tool, may press the metal component toward theinterstitial material and ceramic component and cause the metalcomponent to rotate. The linear and/or rotational movement between thecomponents may cause the interstitial material to melt, but not themetal or ceramic components. This may result in a molecular bond betweenthe mating materials.

Reference will now be made to the accompanying drawings, which assist inillustrating various features of the present disclosure. The followingdescription is presented for purposes of illustration and description.Furthermore, the description is not intended to limit the inventiveaspects to the forms disclosed herein. Consequently, variations andmodifications commensurate with the following teachings, and skill andknowledge of the relevant art, are within the scope of the presentinventive aspects.

FIG. 1 depicts an example electronic device 104 having an compositestructure, such as the composite structure generally discussed above anddescribed in more detail below. For purposes of illustration, theelectronic device 104 is depicted as having an enclosure 108, a display112 (e.g., including a touch-sensitive display configured to receiveinput), one or more input/output members 116, and a speaker 120. Itshould be noted that the electronic device 104 may also include variousother components, such as one or more ports (e.g., charging ports, datatransfer ports, or the like), additional input/output buttons, and soon. As such, the discussion of any electronic device, such as electronicdevice 104, is meant as illustrative only.

The electronic device 104 may be substantially any type of device havingan enclosure formed from dissimilar materials. Some example electronicdevices may include desktop computers, notebook computers, smart phones(as shown in FIG. 1A), tablets, portable media players, or the like.Other example electronic devices may include wearable devices (includingwatches, gloves, rings, or the like), health monitoring devices(including pedometers, heart rate monitors, or the like), and otherelectronic devices, including digital cameras, printers, scanners,security systems or devices. In some cases, the electronic device 104need not be an electronic device. For example, the electronic device 104may be substantially any device with an outer shell, housing, enclosure,or the like constructed from dissimilar materials that form a compositestructure having an interstitial material.

In one embodiment, the enclosure 108 may be formed from a compositestructure having an enclosure component and an internal componentaffixed to one another using an interstitial materials that form ablended melt layer. This may allow the enclosure 108 to have dissimilarmaterials affixed to one another and forming different features orelements of the enclosure 108. For example, the enclosure 108 mayinclude an enclosure component formed from an enclosure material and aninternal component formed from a metal material different than theenclosure material affixed to one another along a bonding region definedby the blended melt layer (not shown in FIG. 1). As described in greaterdetail below, the enclosure component may define an exterior surface 150of the enclosure 108 and enclose or define an internal volume of theelectronic device 104. The internal component may be affixed to theenclosure component within the internal volume and may be a structuralcomponent of the electronic device.

In one embodiment, the enclosure 108 may be constructed of variouscombinations of aluminum and steel components. In one embodiment, theenclosure 108 may include an enclosure component formed from an aluminumor aluminum alloy and the internal component may be a steel component ofsteel alloy. The aluminum alloy may provide a durable, chemicalresistant barrier between internal components of the electronic device(e.g., the PCB, sensors, switches or the like) and an externalenvironment. For example, the enclosure 108 may be exposed to anexternal environment containing various contaminants, including oils,sweat, dust, moisture, and/or other contaminants that may adverselyaffect the operation of the electronic device 104. The aluminumcomponent may physically obstruct such contaminants from entering theenclosure 108. Further, the aluminum component may exhibit a chemicalresistivity such that it does not substantially break down, degrade,corrode, or otherwise diminish when exposed to the contaminants. Thesteel or steel alloy that forms the internal component may be bonded tothe aluminum component within the internal volume of the electronicdevice and provide enhanced rigidity and hardness to the exteriorsurface 150 that is defined by the aluminum component. Additionally, thesteel or steel alloy may be machineable, for example, to define athreaded feature or other structural member that is used to connect acomponent of the electronic device (e.g., such as the PCB) to theenclosure 108. In some cases, the internal component may be configuredto electrically conduct a signal received from the PCB.

It will be appreciated that the foregoing example constructions of theenclosure 108 are presented for purposes of illustration. Otherembodiments of the enclosure 108 formed from a composite structure ofaluminum and steel are contemplated within the scope of this disclosure.For example, in some cases, the enclosure component may be formed fromsteel and the internal component may be formed from aluminum.Additionally or alternatively, the enclosure 108 may include a steelcomponent having aluminum components affixed to opposing surfaces of thesteel component using an interstitial material formed along each of theopposing surfaces of the steel component. In other cases, the enclosure108 may include an aluminum component having steel components affixed toopposing surfaces of the aluminum component using an interstitialmaterial formed along each of the opposing surface of the aluminumcomponent. In other embodiments, other constructions of the enclosure108 are completed, including embodiments having multiple, alternatinglayers of aluminum components affixed to steel components, according tothe embodiments described herein.

In another implementation, the enclosure 108 may include a compositestructure formed from a ceramic and a metal material. For example, theenclosure 108 may include an enclosure component formed from a ceramicmaterial and an internal component formed from a metal material. Theceramic material and the metal material may be affixed to one anotheralong a bonding region defined by an interstitial material (not shown inFIG. 1). As one possibility, as described with respect to FIG. 7, theinternal components may be metal embossments or other protrusionsaffixed to the ceramic enclosure component outer surface using a bondingtool that rotates the metal component such that the interstitialmaterial melts and subsequently bonds the metal and ceramic componentsto one another. In some cases, the metal component may be a decorativeor aesthetic enhancement to the ceramic component. In other cases, themetal component may be a structural component of the electronic device104 (e.g., such as an attachment feature configured to structurallysupport electronic circuitry of the electronic device 104).

FIG. 2 is a cross-sectional view of the electronic device 104 of FIG. 1,taken along line A-A of FIG. 1. As illustrated, the electronic device104 includes the enclosure 108 and device components 124. The devicecomponents 124 may be a PCB, sensor, or any other internal component ofthe electronic device 104. For example, one or more of the devicecomponents 124 may be a PCB that is configured to control a function ofthe electronic device 104. The PCB may include contacts (not shown) forconducting electrical signals and/or detecting an actuation of a switch.

The enclosure 108 may be constructed from a set of layers. As shown inFIG. 2, the enclosure 108 includes an internal component 128, aninterstitial material 132, and an enclosure component 136. The enclosurecomponent 136 is shown proximal to the exterior surface 150 of theenclosure 108 and the internal component 128 is shown proximal to, orat, an interior volume defined by the enclosure 108. As shown in FIG. 2,the enclosure 108 may optionally include an exterior layer 140. Theexterior layer 140 may be a cover glass formed from sapphire, conundrum,silica, or the like that may define the exterior surface 150. In somecases, as described with respect to FIG. 3, the exterior layer 140 mayextend over the enclosure component 136 and the display 112.Additionally or alternatively, the exterior layer 140 may be definedpartially or fully by a coating, paint, ink or other material that mayprovide a protective seal, decorative trim, or the like disposed on, orover, enclosure component 136.

In an embodiment, the enclosure component 136 may be constructedentirely, or partially, from aluminum or various aluminum alloys (e.g.,including aluminum-based compounds having one or more of silicon, iron,copper, manganese, magnesium, or other appropriate elements). In somecases, the aluminum may be an anodized aluminum structure. The enclosurecomponent 136 may be shaped in any appropriate manner for a givenapplication, including linear and non-linear shapes. In some instances,the enclosure component 136 may be substantially planar and may resemblea plate or a sheet structure. The aluminum of the enclosure component136 may have a melting temperature that is less than a meltingtemperature of the internal component 128 (e.g., where the internalcomponent 128 is formed from steel or steel alloy). In some cases, thealuminum of the enclosure component 136 may have a melting temperaturewithin a range of 800 degrees Fahrenheit to 1300 degrees Fahrenheit,based on the material composition of the aluminum. In other embodiments,the aluminum of the enclosure component 136 may have a meltingtemperature that is less than 800 degrees Fahrenheit or greater than1300 degrees Fahrenheit.

The internal component 128 may be constructed entirely, or partially,from steel or various steel alloys (e.g., including steel-basedcompounds having one or more of silicon, chromium, manganese, nickel,titanium, copper, or other appropriate elements). The internal component128 may be shaped in any appropriate manner for a given application,including linear and non-linear shapes. In some instances, the internalcomponent 128 may be substantially planar and may resemble a plate or asheet structure. In other cases, as described with respect to FIGS.8A-10C, the internal component 128 may define a threaded feature, boss,plate, shield, rib, or other feature of the enclosure 108. In thisregard, the internal component 128 may be a structural component of theenclosure 108 that is configured to secure a component of the electronicdevice 104, such as a PCB, to the enclosure component 136. In somecases, the internal component 128 may be configured to electricallyconduct a signal received from the PCB.

The steel of the internal component 128 may have a melting temperaturethat is greater than the melting temperature of the enclosure component136 (e.g., where the enclosure component 136 is formed from aluminum oraluminum alloy). In some cases, the steel of the internal component 128may have a melting temperature within a range of 2600 degrees Fahrenheitto 2800 degrees Fahrenheit, based on the material composition of thesteel. In other embodiments, the steel of the internal component 128 mayhave a melting temperature that is less than 2600 degrees Fahrenheit orgreater than 2800 degrees Fahrenheit.

The interstitial material 132 may be positioned between the internalcomponent 128 and the enclosure component 136. The interstitial material132 may be used to define or form a blended melt layer between theinternal component 128 and the enclosure component 136. In this manner,the internal component 128 and the enclosure component 136 may beaffixed to one another via the interstitial material 132. As describedin greater detail below (e.g., as described with respect to FIGS.4A-4C), in one embodiment, a portion of the interstitial material 132may be directly or chemically bonded with a portion of the internalcomponent 128 at the blended melt layer (e.g., a region of the enclosure108 at which heat is applied to melt the interstitial material 132, andoptionally the enclosure component 136, without melting the internalcomponent 128).

FIG. 3 is a cross-sectional view of the electronic device 104 of FIG. 1,taken along line B-B of FIG. 1. As illustrated, the electronic device104 includes enclosure 108′ and the display 112. The enclosure 108′shown and described with respect to FIG. 3 may be substantiallyanalogous to the enclosure 108 described with respect to FIG. 2. Forexample, the enclosure 108′ may include the enclosure component 136; theinterstitial material 132; the internal component 128; and the exteriorlayer 140.

Notwithstanding the foregoing similarities to the enclosure 108, theenclosure 108′ may be configured such that both the enclosure component136 and the internal component 128 are positioned proximal to theexterior surface 150 of the enclosure 108. As shown in FIG. 3, theinternal component 128 may form a portion of the enclosure 108′ and maybe separated from the display 112 by an opening 114. The opening 114 maybe formed by the enclosure 108 and configured to receive the display112. This may facilitate attachment of the display 112 to the devicecomponents 124. The exterior layer 140 may be a cover glass or othertransparent, or partially transparent, layer that defines at least aportion of the exterior surface 150. In this regard, the exterior layer140 may extend over the enclosure component 136, the interstitialmaterial 132, the internal component 128, the opening 114, and thedisplay 112. Accordingly, the exterior layer 140 may form a cosmeticlayer and/or a function component of the electronic device 104, such asby forming a transparent and protective layer over the display 112.

FIG. 4A illustrates a first component 404 and a second component 412prior to affixing the first component 404 and the second component 412to create a composite structure. The first component 404 is shown ashaving a first interstitial material 408. The second component 412 isshown as having a second interstitial material 416. The first component404 and the second component 412 may be substantially analogous to theenclosure component 136 and the internal component 128, respectively,described above with respect to FIGS. 1-3. However, it will beappreciated that the first and second components 404, 412 may besubstantially components of the electronic device 104 described above,including embodiments in which the first and second components 404, 412are substantially analogous to the internal component 128 and theenclosure component 136, respectively.

In one embodiment, the first and second interstitial materials 408, 416may be constructed entirely, or partially, from nickel or various nickelalloys (e.g., including nickel-based compounds having one or more ofchromium, cobalt, iron, titanium, tungsten, molybdenum, or otherappropriate elements). Additionally or alternatively, the first andsecond interstitial materials 408, 416 may be constructed entirely, orpartially, from zinc (e.g., Zn), or various zinc alloys (e.g., includingzinc-based compounds having one or more of copper, nickel, silver,aluminum, magnesium, lead, or other appropriate elements). In otherembodiments, the first and second interstitial materials 408, 416 may beconstructed from one or more aluminum alloys.

The first and second interstitial materials 408, 416 may have a meltingtemperature that is less than a melting temperature of the secondcomponent 412. For example, where the first and second interstitialmaterials 408, 416 are constructed from nickel, the first and secondinterstitial materials 408, 416 may have a melting temperaturesubstantially within a range of 1600 degrees Fahrenheit to 2700 degreesFahrenheit. In other cases, where the first and second interstitialmaterials 408, 416 are constructed from zinc, the first and secondinterstitial materials 408, 416 may have a melting temperaturesubstantially within a range of 750 degrees Fahrenheit to 1750 degreesFahrenheit. The first and second interstitial materials 408, 416 neednot be constructed from the same materials. For instance, the first andsecond interstitial materials 408, 416 may be constructed from differentalloys. Accordingly, the first and second interstitial materials 408,416 may have different melting temperatures, as may be appropriate for agiven application.

The first interstitial material 408 may be affixed to the firstcomponent 404. In one embodiment, the first interstitial material 408may be plated, cladded, and/or coated onto a surface of the firstcomponent 404. In other embodiments, other techniques for affixing thefirst interstitial material 408 to the first component 404 arecontemplated within the scope of the present disclosure. The firstinterstitial material 408 is affixed to the first component 404 prior tothe affixing of the first component 404 and the second component 412 tocreate a composite structure. The combination of the first component 404and the first interstitial material 408 may therefore define anon-separable structure that is affixed to the second component 412within the composite structure.

The second interstitial material 416 may be affixed to the secondcomponent 412. In one embodiment, the second interstitial material 416may be plated, cladded, and/or coated onto a surface of the secondcomponent 412. In other embodiments, other techniques for affixing thesecond interstitial material 416 to the second component 412 arecontemplated within the scope of the present disclosure. The secondinterstitial material 416 is affixed to the second component 412 priorto the affixing of the first component 404 to the second component 412to create a composite structure. The combination of the second component412 and the second interstitial material 416 may therefore define anon-separable structure that is affixed to the first component 404within the composite structure.

FIG. 4B shows the first component 404 and the second component 412combined to form a composite structure 450. The composite structure 450may be formed via a coupling process that affixes the first component404 to the second component 412, according to the embodiments describedherein (e.g., as described with respect to FIGS. 4C and 7). Thecomposite structure 450 may include a blended melt layer 420. Asdescribed with respect to FIG. 4C, the blended melt layer 420 may beformed from a portion of one or more of the material of the firstcomponent 404 and the first and second interstitial materials 408, 416.The blended melt layer 420 may be positioned between the first component404 and the second component 412. The blended melt layer 420 may beaffixed to both the first component 404 and the second component 412. Inthis regard, the first component 404 may be affixed to the secondcomponent 412 via the blended melt layer 420.

FIG. 4C depicts detail 1-1 of FIG. 4B of the composite structure 450. Asshown in the non-limiting example of FIG. 4C, the blended melt layer 420may include a diminished interstitial material 424 and a transitionlayer 428. The diminished interstitial material 424 and the transitionlayer 428 may be at least partially formed from (with reference to FIG.4A) the interstitial materials 408, 416 as a result of the couplingprocesses described herein.

In one embodiment, a coupling process may involve positioning the firstcomponent 404 and the second component 412 such that the interstitialmaterials 408, 416 abut. The coupling process may heat the firstcomponent 404, the second component 412, and the first and secondinterstitial materials 408, 416 (or portions or combinations thereof) toa bonding temperature that melts a portion of the material that formsthe first component 404 and a portion of one, or both, of the first andsecond interstitial materials 408, 416. Melting the portion of the firstcomponent 404 and the portion of one, or both, of the first and secondinterstitial materials 408, 416 may form the transition layer 428. Assuch, the transition layer 428 may include a region of the compositestructure 450 at which portions of the first component 404 are directlyor chemically bonded to the elements of the first or second interstitialmaterials 408, 416. The diminished interstitial material 424 may beformed from the portion of one, or both, of the first and secondinterstitial materials 408, 416, for example, that may not be melted orotherwise formed into the transition layer 428. The diminishedinterstitial material 424 may not include material from the secondcomponent 412; as the second component is not melted, the diminishedinterstitial material 424 may remain affixed to the second component412, but not melted or blended together.

The coupling process may cause the first component 404 to affix to thetransition layer 428. For example, the coupling process may melt thefirst component 404 at or near the surface of the first component 404where the first interstitial material 408 is positioned. The meltedportion of the first component 404 may therefore melt into, and formwith, one or both of the first and second interstitial materials 408,416 to form the composite structure 450. The portion of the firstcomponent 404 not melted as a result of the coupling process maytherefore be affixed with the transition layer 428 upon the cooling ofthe composite structure 450. The first component 404 depicted in FIG. 4Cthus may be smaller than, or diminished from, the first component 404depicted in FIG. 4A.

In a similar manner, the coupling process may cause the diminishedinterstitial material 424 to be affixed with the transition layer 428.As one example, a portion of the second interstitial material 416 may bemelted into, and formed with, the transition layer 428. The portion ofthe second interstitial material 416 not melted as result of thecoupling process may therefore be affixed with the transition layer 428upon the cooling of the composite structure 450. The diminishedinterstitial material 424 deposited in FIG. 4C may therefore be smallerthan, or diminished from, the second interstitial material 416 depictedin FIG. 4A.

It will be appreciated that, in some embodiments, the blended melt layer420 need not include the diminished interstitial material 424. Forexample, the blended melt layer 420 may be substantially defined by thetransition layer 428. This may occur where substantially all of thefirst and second interstitial materials 408, 416 are melted as a resultof the coupling process.

Alternatively, the blended melt layer 420 need not include thetransition layer 428. For example, the blended melt layer 420 may besubstantially defined by the diminished interstitial material 424. Thismay occur where the first component 404 is not melted as a result of thecoupling process. For example, rather than melt the first component 404,the coupling process may melt a portion of each of the first and secondinterstitial materials 408, 416 to define the blended melt layer 420.Stated differently, the first interstitial material 408 may be directlyor chemically bonded to the second interstitial material 416, therebyaffixing the first component 404 to the second component 412 withoutmelting the first component 404 or the second component 412.

As illustrated in FIG. 4C, the diminished interstitial material 424 isaffixed to the second component 412. The interface between thediminished interstitial material 424 and the second component 412 may besubstantially the same as the interface between the second interstitialmaterial 416 and the second component 412 depicted in FIG. 4A. In thismanner, the diminished interstitial material 424 may be affixed to thesecond component 412 within the composite structure 450 via a plating,cladding, or other appropriate bonding technique. The coupling processmay not melt the second component 412 (e.g., the bonding temperatureutilized in the coupling process may be less than a melting temperatureof the second component 412). Accordingly, the second component 412 maybe substantially the same size and shape as the second component 412depicted in FIG. 4A.

FIG. 5A illustrates a first component 504 and a second component 512prior to affixing the first component 504 and the second component 512to create a composite structure. The first component 504 is shown aspositioned adjacent a first interstitial sheet 508. The second component512 is shown positioned adjacent a second interstitial sheet 516. Thefirst component 504 and the second component 512 may be substantiallyanalogous to the enclosure component 136 and the internal component 128,respectively, described above with respect to FIGS. 1-3. However, itwill be appreciated that the first and second components 504, 512 may besubstantially components of the electronic device 104 described above,including embodiments in which the first and second components 504, 512are substantially analogous to the internal component 128 and theenclosure component 136, respectively.

The first and second interstitial sheets 508, 516 may be substantiallyanalogous to the first and second interstitial materials 408, 416described above with respect to FIGS. 4A-4C. For example, the first andsecond interstitial sheets 508, 516 may be formed from various metallicelements, including nickel, zinc, and aluminum alloy and have a meltingtemperature that is less than a melting temperature of the secondcomponent 512. Notwithstanding the foregoing, the first and secondinterstitial sheets 508, 516 may be a film, laminate, sheet, and/orother conforming or substantially planar layer that may be applied toone or both of the first and second components 504, 512. In some cases,the first and second interstitial sheets 508, 516 may be used to augmentor otherwise tailor a volume of interstitial material used to form acomposite structure from the first and second components 504, 512.Additionally or alternatively, the first and second interstitial sheets508, 516 may be configured to conform to (and at least partially fill)irregularities or other surface imperfections within the first andsecond components 504, 512 that may otherwise impede bonding.

FIG. 5B shows the first component 504 and the second component 512combined to form a composite structure 550. The composite structure 550may be formed via a coupling process that affixes the first component504 to the second component 512, according to the embodiments describedherein (e.g., as described with respect to FIGS. 4C and 7). Thecomposite structure 550 may include a blended melt layer 520. Theblended melt layer 520 may be positioned between the first component 504and the second component 512. The blended melt layer 520 may be attachedto both the first component 504 and the second component 512. In thisregard, the first component 504 may be affixed to the second component512 via the blended melt layer 520.

The composite structure 550 may be constructed in a manner substantiallyanalogous to the composite structure 450 depicted in FIGS. 4A-4C. Forexample, the composite structure 550 may be constructed using thecoupling process described with respect to FIG. 4C. Notwithstanding theforegoing similarities, the blended melt layer 520 may be at leastpartially defined by one or more of the first and second interstitialsheets 508, 516. To illustrate, the coupling process may involvepositioning the first component 504 and the second component 512 suchthat the first and second interstitial sheets 508, 516 abut. Thecoupling process may heat the first component 504, the second component512, and the first and second interstitial sheets 508, 516 (or portionsor combinations thereof) to a bonding temperature. This may cause aportion of the first component 504 and a portion of one, or both, of thefirst and second interstitial sheets 508, 516 to melt. Melting theportion of the first component 504 and the portion of one, or both, ofthe first and second interstitial sheets 508, 516 may partially form theblended melt layer 520. This may allow the first component 504 and thefirst and second interstitial sheets 508, 516 to be affixed to oneanother via direct or chemical bonding. The bonding temperature may beless than a melting temperature of the second component 512. In thisregard, the second component 512 may be affixed to the blended meltlayer 520 (and thus to the first component 504), rather than beingpartially melted into the blended melt layer 520.

FIG. 6A illustrates a first component 604 and a second component 612prior to affixing the first component 604 and the second component 612to create a composite structure. The second component 612 is shown ashaving a interstitial material 616. The first component 604 and thesecond component 612 may be substantially analogous to the enclosurecomponent 136 and the internal component 128, respectively, describedabove with respect to FIGS. 1-3. However, it will be appreciated thatthe first and second components 604, 612 may be substantially componentsof the electronic device 104 described above, including embodiments inwhich the first and second components 604, 612 are substantiallyanalogous to the internal component 128 and the enclosure component 136,respectively.

The interstitial material 616 may be affixed to the second component 612in the same manner as (with reference to FIG. 4A) the secondinterstitial material 416 is affixed to the second component 412. Forexample, the interstitial material 616 may be plated, cladded, coated orotherwise affixed to the second component 612.

FIG. 6B shows the first component 604 and the second component 612combined to form a composite structure 650. The composite structure 650may be formed via a coupling process that affixes the first component604 to the second component 612, according to the embodiments describedherein (e.g., as described with respect to FIGS. 4C and 7). Thecomposite structure 650 may include a blended melt layer 620. Theblended melt layer 620 may be positioned between the first component 604and the second component 612. The blended melt layer 620 may be attachedto both the first component 604 and the second component 612. In thisregard, the first component 604 may be affixed to the second component612 via the blended melt layer 620.

The composite structure 650 may be constructed in a manner substantiallyanalogous to the composite structure 450 depicted in FIGS. 4A-4C. Forexample, the composite structure 650 may be constructed using thecoupling process described with respect to FIG. 4C. Notwithstanding theforegoing similarities, the blended melt layer 620 may be at leastpartially defined by the interstitial material 616. To illustrate, thecoupling process may involve positioning the first component 604 and thesecond component 612 such that the interstitial material 616 and thefirst component 604 abut. The coupling process may heat the firstcomponent 604, the second component 612, and the interstitial material616 (or portions or combinations thereof) to a bonding temperature. Thismay cause a portion of the first component 604 and a portion of theinterstitial material 616 to melt. Melting the portion of the firstcomponent 604 and the portion of the interstitial material 616 maypartially form the blended melt layer 620. This may allow the firstcomponent 604 and the interstitial material 616 to be affixed to oneanother via direct or chemical bonding. The bonding temperature may beless than a melting temperature of the second component 612. In thisregard, the second component 612 may be affixed to the blended meltlayer 620 (and thus to the first component 604), rather than beingpartially melted into the blended melt layer 620.

In an embodiment, various ultrasonic bonding techniques may be used toaffix two dissimilar materials via an interstitial material. Forexample, a bonding tool, ultrasonic transducer, or appropriate tool mayinduce rotational and/or axial movement in at least one of thedissimilar materials that causes the interstitial material to melt, andestablish a molecular bond between the dissimilar materials.

In this regard, FIG. 7 depicts a bonding operation that may be used toform a composite structure of dissimilar materials using an ultrasonicbonding tool. As illustrated, the bonding operation includes a bondingtool 702. The bonding tool 702 may be an ultrasonic transducer or otherrotary tool designed for high speed rotational movement and may becapable of performing a rotational interstitial welding operation. Forexample, the bonding tool 702 may rotate or oscillate in a generallycircular direction about a longitudinal direction of the bonding tool702 while compressing one or more materials positioned along thelongitudinal axis. The bonding tool 702 may rotate or oscillateaccording to a predetermined frequency that is configured to heat abonding region between the dissimilar materials. Sample frequencies forthe operation of the bonding tool 702 include 15 kHz, 20 kHz, 30 kHz, 35kHz, 40 kHz, and 70 kHz; however, it will be appreciated that otherfrequencies are contemplated.

The bonding tool 702 may be releasably coupled with an internalcomponent 704. For example, the internal component 704 may betemporarily affixed to the bonding tool 702 during axial and/orrotational movement of the bonding tool 702, and subsequently disengaged(e.g., after cessation of the axial and/or rotational movement). In thisregard, as shown in FIG. 7, a portion of the internal component 704 maybe received by the bonding tool 702. This engagement of the internalcomponent 704 and the bonding tool 702 may therefore cause the internalcomponent 704 to rotate and/or translate in response to correspondingrotational or axial movements of the bonding tool 702. In an embodiment,the internal component 704 may be any appropriate metal structure, asdescribed herein, including being constructed from titanium, steel, orother metal or metal alloys. In other cases, the internal component 704may be constructed from other materials.

The bonding tool 702 may press the internal component 704 to abut aninterstitial material 720. The interstitial material 720 may be a foilor a sheet constructed from tin, aluminum or other material having alower melting point than that of the internal component 704, includingzinc and nickel, as described herein. The interstitial material 720 mayhave a thickness that is substantially less than the thickness of theinternal component 704.

The interstitial material 720 may be positioned on an exterior surfaceof an enclosure component 712. The enclosure component 712 may be anyappropriate ceramic component, including being constructed from zirconiaaluminum (ZrO₂AI₂O₃), zirconia (ZrO₂), or other ceramic-based material.In other cases, the enclosure component 712 may be an aluminum oraluminum alloy structure. For some cases, the enclosure component 712may form an outer casing or shell of an electronic device housing, suchas for the electronic device 104 described with respect to FIGS. 1-3. Inan embodiment, the enclosure component 712 may be constructed from aceramic or ceramic-based material.

In operation, the bonding tool 702 may move the internal component 704towards the enclosure component 712 so as to compress the interstitialmaterial 720 between the internal component 704 and the enclosurecomponent 712. Subsequently, the bonding tool 702 may cause the internalcomponent 704 to rotate relative to the interstitial material 720 andenclosure component 712 while maintaining the compression of theinterstitial material 720 between the internal component 704 and theenclosure component 712. The rotation of the internal component 704 bythe bonding tool 702 may generate heat within the interstitial material720 and surrounding portions of the internal component 704 and theenclosure component 712. This may cause a portion of the interstitialmaterial 720 to melt and form a molecular bond with one or both of theinternal component 704 and/or the enclosure component 712.

The bonding tool 702 may continue to translate and rotate the internalcomponent 704 until a sufficient bond strength is reached that causesthe internal component 704 and the enclosure component 712 topermanently affix to one another. Upon completion of the bonding, thebonding tool 702 may be disengaged from the internal component 704.

FIGS. 8A-10C depict various electronic devices having compositestructures. Broadly, the composite structures described above withrespect to FIGS. 1-7 may be used to form various components of anelectronic device. For example, the composite structures may be used toform a portion of an enclosure, housing, or other feature of anelectronic device. In some cases, as described in greater detail below,the composite structures may include an enclosure component that forms awall or surface of a device enclosure and an internal component thatforms a structural member of the enclosure (e.g., a threaded connection,a structural rib, and so on). The enclosure component and the internalcomponent may be affixed to one another, as described herein, such thatthe structural member may be bonded with the wall or surface of theenclosure.

FIG. 8A depicts an example electronic device 804. The electronic device804 may include, or be formed from, a composite structure, such as thecomposite structures 450, 550, 650 described above with respect to FIGS.4A-6B. As shown in FIG. 8A, the electronic device 804 may be a portableelectronic device, such as a mobile phone, tablet computer, or othercomputing device having a touch-sensitive display positioned within anenclosure or housing. In other embodiments, as described herein, theelectronic device 804 may be substantially any type of electronic devicehaving an enclosure component affixed to an internal component via aninterstitial material.

For purposes of illustration, electronic device 804 is shown having anenclosure 808, a display 812, one or more input/output members 816, anda speaker 820. It should be noted that the electronic device 804 mayalso include various other components, such as one or more ports (e.g.,charging ports, data transfer ports, or the like), additionalinput/output buttons, and so on. As such, the discussion of anyelectronic device, such as electronic device 804, is meant asillustrative only.

The enclosure 808 may be formed from various combinations of compositestructures, for example, such as from various combinations of enclosureand internal components affixed to one another using an interstitialmaterial. In one embodiment, one or more walls of the enclosure 808 maybe substantially formed from an enclosure component formed from anenclosure material that defines or encloses an internal volume. Aninternal component (not shown in FIG. 8A) formed from a metal materialthat is different than the enclosure material may be affixed to theenclosure component within the interior volume via an interstitialmaterial, thereby forming a composite structure.

FIG. 8B depicts an exploded view of an embodiment of the electronicdevice 804 shown in FIG. 8A. In the exploded view, for purposes ofillustration, the enclosure 808 is shown separated into a top portionand a bottom portion. However, it will be appreciated that the enclosure808 may be a substantially integrally formed or unitary structure or,alternatively, may include multiple separable pieces that collectivelydefine the enclosure 808.

As described above, the enclosure 808 may be formed partially or fullyfrom an enclosure component and an internal component that form acomposite structure. For example, the enclosure 808 may include aninterior surface 850 formed from an enclosure material. Internalcomponents may be affixed to the enclosure component along the interiorsurface 850. For example, as shown in FIG. 8B, threaded features 854 maybe affixed to the interior surface 850. The threaded features 854affixed to the interior surface 850 may form a composite structure, asdescribed herein. For example, the threaded features 854 may be aninternal component of the enclosure 808 and substantially formed from ametal material that is affixed (via an interstitial material) to theenclosure material that forms the interior surface 850. The threadedfeatures 854 may be mounting features, bosses, or other structuralmembers that are used to connect or secure one or more components of theelectronic device 804 to the enclosure 808.

In this regard, as shown in FIG. 8B, the electronic device 804 mayinclude a printed circuit board (PCB) 890. The PCB 890 may includeelectrical components 892 (e.g., processing units, switches, sensors,wires, or the like) that control one or more functions of the electronicdevice 804. The PCB 890 may be secured to the interior surface 850 ofthe enclosure 808 using the threaded features 854. For example, the PCB890 may define openings 894. The threaded features 854 may be advancedthrough respective ones of the openings 894 such that the PCB 890 issecured to enclosure 808.

FIG. 8C depicts detail 2-2 of FIG. 8B of the interior surface 850. Asshown in the non-limiting example of FIG. 8C, one of the threadedfeatures 854 is affixed to the interior surface 850. The threadedfeatures 854 shown in FIG. 8B may be affixed to the interior surface 850via an interstitial materials 858. The interstitial material 858 maydefine a bonding region that affixes the threaded features 854 and theinterior surface 850. For example, the interstitial material 858 mayinclude a plated, cladded, or coated interstitial material (e.g.,including zinc, nickel, aluminum alloy, or the like) that bonds themetal material of the threaded feature 854 to the enclosure material ofthe interior surface 850 as a result of a coupling process. The couplingprocess may involve melting a portion of the metal material and theinterstitial material and/or applying a localized compression force tothe internal and enclosure components. It will be appreciated that theinterstitial material 858 may have a thickness that is substantiallyless than a thickness of the enclosure 808 or the threaded feature 854,and is therefore depicted in FIG. 8C for purposes of illustration only.

FIG. 9A depicts an example electronic device 904. The electronic device904 may include, or be formed from, a composite structure, such as thecomposite structures 450, 550, 650 described above with respect to FIGS.4A-6B. As shown in FIG. 9A, the electronic device 904 may be a laptopcomputer. In other embodiments, as described herein, the electronicdevice 904 may be substantially any type of electronic device having anenclosure component affixed to an internal component via an interstitialmaterial.

For purposes of illustration, electronic device 904 is shown having anenclosure 908, a display 912, one or more input/output members 916, anda keyboard assembly 920. It should be noted that the electronic device904 may also include various other components, such as one or more ports(e.g., charging ports, data transfer ports, or the like), additionalinput/output buttons, and so on. As such, the discussion of anyelectronic device, such as electronic device 904, is meant asillustrative only.

The enclosure 908 may be formed from various combinations of compositestructures, for example, such as from various combinations of enclosureand internal components affixed to one another using an interstitialmaterial. In one embodiment, one or more walls of the enclosure 908 maybe substantially formed from an enclosure component formed from anenclosure material that defines or encloses an internal volume. Aninternal component (not shown in FIG. 9A) formed from a metal materialthat is different than the enclosure material may be affixed to theenclosure component within the interior volume via an interstitialmaterial, thereby forming a composite structure.

FIG. 9B depicts an exploded view of an embodiment of the electronicdevice 904 shown in FIG. 9A. In the exploded view, for purposes ofillustration, the enclosure 908 is shown separated into a top portionand a bottom portion. However, it will be appreciated that the enclosure908 may be a substantially integrally formed or unitary structure or,alternatively, may include multiple separable pieces that collectivelydefine the enclosure 908.

As described above, the enclosure 908 may be formed partially or fullyfrom an enclosure component and an internal component that form acomposite structure. For example, the enclosure 908 may include aninterior surface 950 formed from an enclosure material. Various internalcomponents may be affixed to the enclosure component along the interiorsurface 950

As one example, shown in FIG. 9B, threaded features 954 may be affixedto the interior surface 950. The threaded features 954 affixed to theinterior surface 950 may form a composite structure, as describedherein. For example, the threaded features 954 may be an internalcomponent of the enclosure 908 and substantially formed from a metalmaterial that is affixed (via an interstitial material) to the enclosurematerial that forms the interior surface 950. The threaded features 954may be mounting features, bosses, or the like that are used to connector secure one or more components of the electronic device 904 to theenclosure 908.

In this regard, as shown in FIG. 9B, the electronic device 904 mayinclude a printed circuit board (PCB) 990. The PCB 990 may includeelectrical components 992 (e.g., processing units, switches, sensors,wires, or the like) that control one or more functions of the electronicdevice 904. The PCB 990 may be secured to the interior surface 950 ofthe enclosure 908 using the threaded features 954. For example, the PCB990 may define openings 994. The threaded features 954 may be advancedthrough respective ones of the openings 994 such that the PCB 990 issecured to enclosure 908.

The electronic device 904 may include various other compositestructures. As shown in FIG. 9B, the electronic device 904 may includean internal component that defines ribs 970 that are affixed to theinterior surface 950. The ribs 970 affixed to the interior surface 950may form a composite structure, as described herein. For example, theribs 970 may be an internal component of the enclosure 908 andsubstantially formed from a metal material that is affixed (via aninterstitial material) to the enclosure material that forms the interiorsurface 950. The ribs 970 may be structural ribs that enhance or providerigidity to the enclosure 908, such as providing rigidity to an exteriorsurface of the enclosure 908.

The ribs 970 may extend across the interior surface 950 in multipledirections. For example, the ribs 970 may extend between sidewalls ofthe enclosure 908. In some cases, the ribs 970 separate an internalvolume of the enclosure 908 into discrete compartments. These discretecompartments may be used to secure and/or separate various electroniccomponents or other features of the electronic device 904, for example,such as the PCB 990. In this regard, as described in greater detailbelow with respect to FIG. 9D, the ribs 970 may define a passage thatallows a set of wires 980 to extend between the discrete compartments ofthe internal volume of the enclosure 908.

As another example, as shown in FIG. 9B, the electronic device 904 mayinclude an internal component that defines pins 960. The pins 960affixed to the interior surface 950 may form a composite structure, asdescribed herein. For example, the pins 960 may be substantially formedfrom a metal material that is affixed (via an interstitial material) tothe enclosure material that forms the interior surface 950. The pins 960may be structural members of the electronic device 904 that may, forexample, connect the top and bottom portion of the enclosure 908.

As another example, as shown in FIG. 9B, the electronic device 904 mayinclude an internal component that defines a shield 982. The shield 982may be an electrically or thermally conductive element that shields orprotects one or more components of the electronic device 904 fromundesirable interference. For example, the shield 982 may be shield orprotect one or more components of the electronic device 904 formelectromagnetic radiation. The shield 982 affixed to the interiorsurface 950 may form a composite structure, as described herein. Forexample, the shield 982 may be substantially formed from a metalmaterial that is affixed (via an interstitial material) to the enclosurematerial that forms the interior surface 950.

FIG. 9C depicts detail 3-3 of FIG. 9B of the interior surface 950. Asshown in the non-limiting example of FIG. 9C, one of the threadedfeatures 954 is affixed to the interior surface 950. The threadedfeatures 954 shown in FIG. 9C may be affixed to the interior surface 950via an interstitial material 958. The interstitial material 958 maydefine a bonding region that affixes the threaded feature 954 and theinterior surface 950. For example, the interstitial material 958 mayinclude a plated, cladded, or coated interstitial material (e.g.,including zinc, nickel, aluminum alloy, or the like) that bonds themetal material of the threaded feature 954 to the enclosure material ofthe interior surface 950 as a result of a coupling process. The couplingprocess may involve melting a portion of the enclosure material and theinterstitial material 958 and/or applying a localized compression forceto the internal and enclosure components. It will be appreciated thatthe interstitial material 958 may have a thickness that is substantiallyless than a thickness of the enclosure 908 or the threaded feature 954,and is therefore depicted in FIG. 9C for purposes of illustration only.

FIG. 9D depicts detail 4-4 of FIG. 9B of the interior surface 950. Asshown in the non-limiting example of FIG. 9D, one of the ribs 970 isaffixed to the interior surface 950. The ribs 970 shown in FIG. 9D maybe affixed to the interior surface 950 via an interstitial material 958.As described above, the interstitial material 958 may define a bondingregion that affixes the ribs 970 and the interior surface 950. Forexample, the interstitial material 958 may include a plated, cladded, orcoated interstitial material (e.g., including zinc, nickel, aluminumalloy, or the like) that bonds the metal material of the ribs 970 to theenclosure material of the interior surface 950 as a result of a couplingprocess. The coupling process may involve melting a portion of the metalmaterial and the interstitial material and/or applying a localizedcompression force to the internal and enclosure components. It will beappreciated that the interstitial material 958 may have a thickness thatis substantially less than a thickness of the enclosure 908 or the ribs970, and is therefore depicted in FIG. 9D for purposes of illustrationonly.

As described above, the ribs 970 may separate an internal volume of theenclosure 908 into discrete compartments. The discrete compartments mayhouse or contain various electrical components, including PCB 990. Inthis regard, as shown in FIG. 9D, the ribs 970 may define a passage 972.The passage 972 may be a through portion or opening formed into alocalized region of the ribs 970. The passage 972 may be configured toallow the set of wires 980 to extend between the discrete compartmentsof the internal volume of the enclosure 908. This may allow the ribs 970to enhance the structural integrity of the enclosure 908 whilefacilitating electrical connections between the various electricalcomponents of the electronic device 904.

FIG. 10A depicts an electronic device 1004. The electronic device 1004may include, or be formed from, a composite structure, such as thecomposite structures 450, 550, 650 described above with respect to FIGS.4A-6B. As shown in FIG. 10A, the electronic device 1004 may be aportable electronic device, such as a watch, or other computing devicehaving a touch-sensitive display positioned within an enclosure orhousing. In other embodiments, as described herein, the electronicdevice 1004 may be substantially any type of electronic device having anenclosure component affixed to an internal component via an interstitialmaterial.

For purposes of illustration, the electronic device 1004 is shown havingan enclosure 1008, a display 1012, one or more input/output members1016, and a speaker band 1024. It should be noted that the electronicdevice 1004 may also include various other components, such as one ormore ports (e.g., charging ports, data transfer ports, or the like),additional input/output buttons, and so on. As such, the discussion ofany electronic device, such as electronic device 1004, is meant asillustrative only.

The enclosure 1008 may be formed from various combinations of compositestructures, for example, such as from various combinations of enclosureand internal components affixed to one another using an interstitialmaterial. In one embodiment, one or more walls of the enclosure 1008 maybe substantially formed from an enclosure component formed from anenclosure material that defines or encloses an internal volume. Aninternal component (not shown in FIG. 10A) formed from a metal materialthat is different than the enclosure material may be affixed to theenclosure component within the interior volume via an interstitialmaterial, thereby forming a composite structure. FIG. 10B depicts anexploded view of an embodiment of the electronic device 1004 shown inFIG. 10A. In the exploded view, for purposes of illustration, theenclosure 1008 is shown separated into a top portion and a bottomportion. However, it will be appreciated that the enclosure 1008 may bea substantially integrally formed or unitary structure or,alternatively, may include multiple separable pieces that collectivelydefine the enclosure 1008.

As described above, the enclosure 1008 may be formed partially or fullyfrom an enclosure component and an internal component. For example, theenclosure 1008 may include an interior surface 1050 formed from anenclosure material. Internal components may be affixed to the enclosurecomponent along the interior surface 1050. For example, as shown in FIG.10B, threaded features 1054 may be affixed to the interior surface 1050.The threaded feature 1054 affixed to the interior surface 1050 may forma composite structure, as described herein. For example, the threadedfeatures 1054 may be an internal component of the enclosure 1008 andsubstantially formed from a metal material that is affixed (via aninterstitial material) to the enclosure material that forms the interiorsurface. The threaded features 1054 may be mounting features, bosses, orother structural members that are used to connect or secure one or morecomponents of the electronic device 1004 to the enclosure 1008.

In this regard, as shown in FIG. 10B, the electronic device 1004 mayinclude a printed circuit board (PCB) 1090. The PCB 1090 may includeelectrical components 1092 (e.g., processing units, switches, sensors,wires, or the like) that control one or more functions of the electronicdevice 1004. The PCB 1090 may be secured to the interior surface 1050 ofthe enclosure 1008 using the threaded features 1054. For example, thePCB 1090 may define openings 1094. The threaded feature 1054 may beadvanced through respective ones of the openings 1094 such that the PCB1090 is secured to enclosure 1008.

FIG. 10C depicts detail 5-5 of FIG. 10B of the interior surface 1050. Asshown in the non-limiting example of FIG. 10C, one of the threadedfeatures 1054 is affixed to the interior surface 1050. The threadedfeature 1054 shown in FIG. 10B may be affixed to the interior surface1050 via an interstitial material 1058. The interstitial material 1058may define a bonding region that affixes the threaded feature 1054 andthe interior surface 1050. For example, the interstitial material 1058may include a plated, cladded, or coated interstitial material (e.g.,including zinc, nickel, aluminum alloy, or the like) that bonds themetal material of the threaded feature 1054 to the enclosure material ofthe interior surface 1050 as a result of a coupling process. Thecoupling process may involve melting a portion of the enclosure materialand the interstitial material and/or applying a localized compressionforce to the internal and enclosure components. It will be appreciatedthat the interstitial material 1058 may have a thickness that issubstantially less than a thickness of the enclosure 1008 or thethreaded feature 1054, and is therefore depicted in FIG. 10C forpurposes of illustration only.

To facilitate the reader's understanding of the various functionalitiesof the embodiments discussed herein, reference is now made to the flowdiagram in FIG. 11, which illustrates process 1100. While specific steps(and orders of steps) of the methods presented herein have beenillustrated and will be discussed, other methods (including more, fewer,or different steps than those illustrated) consistent with the teachingspresented herein are also envisioned and encompassed with the presentdisclosure.

With reference to FIG. 11, process 1100 relates generally to a method ofmanufacturing a device enclosure having a composite structure, such asthe composite structures described herein. The “coupling process”described as forming the various composite structures (e.g., compositestructures, 450, 550, 650) may be accomplished using the process 1100.

At operation 1104, an enclosure component may abut an internal componentalong a bonding region. For example and with reference to FIGS. 4A-4C,the first component 404 may abut the second component 412 at a bondingregion substantially defined by the blended melt layer 420. At least thesecond component 412 may include a interstitial material (e.g., secondinterstitial material 416). In some cases, the first component 404 mayalso include a interstitial material (e.g., first interstitial material408). Accordingly, operation 1104 may cause the second interstitialmaterial 416 to contact the first component 404 or the second component412.

At operation 1108, the enclosure component may affix to the internalcomponent by heating a bonding region to a temperature that is less thana melting temperature of one of the enclosure component or the internalcomponent. For example and with reference to FIGS. 4A-4C, subsequent tothe abutment of the first component 404 and the second component 412,the first component 404, the second component 412, and one, or both, ofthe first and second interstitial materials 408, 416 (or portions orcombination thereof) may be heated to a bonding temperature. This maycause, for example, a portion of the first component 404 and a portionof one or both of the first and second interstitial materials 408, 416to melt without melting the second component 412.

Operation 1108 may occur subsequent to anodizing at least of theinternal component or the enclosure component. For example, theenclosure component may be anodized aluminum structure that is affixed,via process 1100 to a steel internal component. In this regard,according to the embodiments described herein, the steel internalcomponent may be affixed to an anodized enclosure component. This may bedue, in part, to the blended melt layer 420 formed as a result ofprocess 1100 that affixes the internal component and the enclosurecomponent to one another.

In some cases, the internal component may be used to affix an electroniccomponent of the electronic device to the enclosure component. Forexample, with reference to FIG. 8B, the second component 812 may be, orotherwise form, the threaded feature 854. In this regard, the PCB 890depicted in FIG. 8B may be attached to the first component 404 (that maydefine the interior surface 850) by advancing a pin through the PCB 890and into the threaded feature 854.

The melted portion of the first component 404 and the portion of theone, or both, of the first and second interstitial materials 408, 416may form a blended melt layer positioned between the first component 404and the second component 412. The blended melt layer may be aheterogeneous layer at which the first component 404 is directly orchemically bonded to one, or both, of the first and second interstitialmaterials 408, 416. The second component 412 may be affixed to theblended melt layer either directly or via a portion of the secondinterstitial material 416 that does not melt as a result of theoperation 1108.

Various techniques may be implemented to heat the bonding region to thebonding temperature, including techniques to heat a localized region ofthe bonding region. In some circumstances, the bonding region may beheated by direct heat (e.g., a welding torch or similar implement)and/or an electrical heating element. In other instances, a generalizedor localized compression force may be applied to the first component 404and the second component 412. The compression force may be used to bondthe first component 404 and the second component 412 at the blended meltlayer 420. Additionally or alternatively, an ultrasonic vibration may beapplied to the first component 404 and the second component 412. Theultrasonic vibration may be used to bond the first component 404 and thesecond component 412 at the blended melt layer 420. In some cases, itmay be desirable to actively cool or quench the bonding region, forexample, to mitigate material defects at the blended melt layer 420caused by phase changes within the blended melt layer 420.

In some embodiments, a surface treatment may be performed on a surfaceof the first component 404, the second component 412, and/or the blendedmelt layer 420. The surface treatment may include polishing, buffing,sand blasting, or coating (or other appropriate treatments) an outersurface of one or more of the first component 404, the second component412, and/or the blended melt layer 420. In some cases, the firstcomponent 404, the second component 412, and/or the blended melt layer420 may form an outer surface of an electronic device (e.g., such as theelectronic device depicted in FIG. 1). In this regard, the surfacetreatment may be performed on an outer surface of the electronic device,which may protect and/or aesthetically enhance the outer surface of theelectronic device. For example, the outer surface of the electronicdevice may be coated so that there is no visible seam between the firstcomponent 404 and the second component 412.

Other examples and implementations are within the scope and spirit ofthe disclosure and appended claims. For example, features implementingfunctions may also be physically located at various positions, includingbeing distributed such that portions of functions are implemented atdifferent physical locations. Also, as used herein, including in theclaims, “or” as used in a list of items prefaced by “at least one of”indicates a disjunctive list such that, for example, a list of “at leastone of A, B, or C” means A or B or C or AB or AC or BC or ABC (i.e., Aand B and C). Further, the term “exemplary” does not mean that thedescribed example is preferred or better than other examples.

The foregoing description, for purposes of explanation, uses specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic device comprising: an enclosurecomprising: an aluminum rear wall defining a rear exterior surface andan interior surface of the enclosure opposite to the rear exteriorsurface; and a set of sidewalls extending from the aluminum rear walland surrounding the interior surface of the enclosure; one or more ribsarranged along a portion of the interior surface, the one or more ribsin combination with the set of sidewalls at least partly defining acompartment on the interior surface of the aluminum rear wall; a set ofmounting features formed from steel, each mounting feature defining athreaded aperture, the set of mounting features extending from a portionof the interior surface located within the compartment; a first bondinglayer disposed between each mounting feature of the set of mountingfeatures and the aluminum rear wall and bonding each mounting feature tothe interior surface of the aluminum rear wall, the first bonding layercomprising: an interstitial material that has a melting temperature lessthan that of the steel, the interstitial material being one of nickel, anickel alloy, zinc, a zinc alloy, or an aluminum alloy; and aluminumfrom the aluminum rear wall melted together with the interstitialmaterial; a circuit assembly positioned over the set of mountingfeatures and defining a set of openings; and a set of threadedfasteners, each threaded fastener of the set of threaded fastenersextending through an opening of the set of openings in the circuitassembly and into a threaded aperture of a respective mounting featureof the set of mounting features, thereby securing the circuit assemblyto the enclosure.
 2. The electronic device of claim 1, wherein: theelectronic device is a laptop computer; the electronic device furthercomprises: a display coupled to the enclosure and configured to producegraphical outputs; and an input system coupled to the enclosure andconfigured to receive inputs from a user; the input system comprises akeyboard; and the display is pivotally coupled to the enclosure.
 3. Theelectronic device of claim 1, wherein: the one or more ribs are formedof steel; further comprising: a second bonding layer disposed betweenthe one or more ribs and the aluminum rear wall and bonding each rib ofthe one or more ribs to the interior surface of the aluminum rear wall,the second bonding layer comprising: the interstitial material; andaluminum from the aluminum rear wall melted together with theinterstitial material.
 4. The electronic device of claim 3, wherein: arib of the one or more ribs defines a passage between the rib and theinterior surface; and the electronic device further comprises anelectrical connector extending through the passage.
 5. The electronicdevice of claim 4, wherein: the compartment is a first compartment; thecircuit assembly is a first circuit assembly; the one or more ribsfurther define at least a portion of a second compartment; theelectronic device further comprises: a second circuit assemblypositioned at least partially in the second compartment; and theelectrical connector electrically couples the first circuit assembly tothe second circuit assembly.
 6. The electronic device of claim 1,wherein the set of sidewalls is formed of aluminum.
 7. The electronicdevice of claim 1, wherein the one or more ribs comprise steel.